| Test Services |
We are a leading supplier of PCB test services to the European market, having secured "Approved Supplier" status with a significant number of companies. We offer a flexible range of services covering prototype runs, small to medium production batches, right through to large, ongoing production runs. The bulk of our capability derives from 3 SPEA 4040 Flying Probe systems, but we also have a variety of other dedicated test equipment which enables us to provide test services across the following platforms:
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Flying Probe
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Shorts Testing utilising both adjacent pin & NZT techniquesDevice and Pin "Opens"Full analogue parametric testingVectorless IC open pin testingDigital testing via probes and fixturing/cablesOptical TestPowered TestBoundary ScanDevice ProgrammingFunctional Test |
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Functional
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RF to 10GhzPower & LoadsAnalogueSensor & transducer technologyAudio and Image acquisitionDigitalData acquisitionMixed signalLabView & Visual Basic |
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Structural Test
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Automatic Optical Inspection both SPEA and GoepelX-Ray |
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Cable Form & Backplane
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ContinuityIsolation and breakdownFault LocationFloating Ground testingHiPot & low voltage testingActive ComponentOptical & conductive wiring |
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Bed of Nail (ICT)
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Shorts and opensAnalogueDigitalPowered testBoundary ScanFunctionalDevice programming |
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Specialist Testing
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Fault insertion testCalibration test programmingField returns diagnosticsBone pile clearing |
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Boundary Scan
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Goepel JTAG TechnologiesAsset Intertech |
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All our test services are conducted to military standards, and we can provide our clients with test coverage, failure, repair reports and certificates of conformity as required. In addition. any failures found during the test process are reworked and re-tested at our facility as part of our standard service.
We currently have partnership agreements for the supply of fully supported test services with a select number of Electronic Manufacturing Service providers. This facility provides them with full technical support to their end-client, offering DFT and coverage assessments in the first instance through to Flying Probe, X-Ray, Optical Test, Bed of Nails, Functional Test during production and ultimately allows them to effectively manage field returns.
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